FunGlass and BizLink: Joint Effort in Material Analysis Using SEM-EDX

The FunGlass Research Centre has launched a scientific collaboration with BizLink Technology (Slovakia) s.r.o., a global provider of interconnect solutions for industrial and cable applications. The joint project focuses on advanced material characterization of component surfaces using SEM-EDX techniques.

BizLink, with operations across Europe and Asia, is renowned for its high-performance cable systems and precision-engineered components. Its interest in research collaboration stems from the need to ensure the long-term reliability and resilience of its products under demanding operational conditions.

As part of the project, FunGlass experts are applying scanning electron microscopy (SEM) combined with energy-dispersive X-ray spectroscopy (EDX) to investigate surface morphology, elemental composition, and potential degradation mechanisms in various materials. The insights gained will support BizLink’s innovation in durable and highly efficient interconnect technologies.

This partnership reflects FunGlass’s ongoing mission to bridge academic expertise with industrial needs, fostering innovation through targeted material analysis and international research cooperation.